The Intel 9th Gen Review: Core i9-9900K, Core i7-9700K and Core i5-9600K Tested
by Ian Cutress on October 19, 2018 9:00 AM EST- Posted in
- CPUs
- Intel
- Coffee Lake
- 14++
- Core 9th Gen
- Core-S
- i9-9900K
- i7-9700K
- i5-9600K
Hardware and Software Security Fixes
The Spectre and Meltdown vulnerabilities made quite a splash earlier this year, forcing makers of hardware and software to release updates in order to tackle them. There are several ways to fix the issues, including software, firmware, and hardware updates. Each generation of product is slowly implementing fixes, including some of the new 9th Generation processors.
At this point Intel has split the list down into 5/6 wide variants of different types of vulnerabilities. For all processors beyond mid-2018, here is what the fix table looks like:
Spectre and Meltdown on Intel | |||||||
AnandTech | SKX-R 3175X |
CFL-R | Cascade Lake | Whiskey Lake |
Amber Lake |
||
Spectre | Variant 1 | Bounds Check Bypass | OS/VMM | OS/VMM | OS/VMM | OS/VMM | OS/VMM |
Spectre | Variant 2 | Branch Target Injection | Firmware + OS | Firmware + OS | Hardware + OS | Firmware + OS | Firmware + OS |
Meltdown | Variant 3 | Rogue Data Cache Load | Firmware | Hardware | Hardware | Hardware | Firmware |
Meltdown | Variant 3a | Rogue System Register Read | Firmware | Firmware | Firmware | Firmware | Firmware |
Variant 4 | Speculative Store Bypass | Firmware + OS | Firmware + OS | Firmware + OS | Firmware + OS | Firmware + OS | |
Variant 5 | L1 Terminal Fault | Firmware | Hardware | Hardware | Hardware | Firmware |
The new 9th Generation processors, listed as CFL-R (Coffee Lake Refresh), has implemented hardware fixes for variant 3, Rogue Data Cache Load, and variant 5, L1 Terminal Fault.
Because the new chips have required new masks for manufacturing, Intel has been able to make these changes. The goal of moving the changes into hardware means that the hardware is always protected, regardless of OS or environment, and with the hope that any additional overhead created by a software fix can be lessened if done in hardware.
(S)TIM: Soldered Down Processors
With the desktop processors we use today, they are built from a silicon die (the smart bit), a package substrate (the green bit), a heatspreader (the silver bit), and a material that helps transfer heat from the silicon die to the heatspreader. The quality of the binding between the silicon die and the heatspreader using this thermal interface material is a key component in the processors ability to remove the heat generated from using it.
Traditionally there are two different types of thermal material: a heat conductive paste, or a bonded metal. Both have positives and negatives.
The heat conductive paste is a universal tool – it can be applied to practically any manufactured processor, and is able to deal with a wide range of changing conditions. Because metals expand under temperature, when a processor is used and gets hot, it expands – so does the heatspreader. The paste can easily deal with this. This allows paste-based processors to live longer and in more environments. Using a bonded metal typically reduces the level of thermal cycling possible, as the metal also expands and contracts in a non-fluid way. This might mean the processors has a rated lifespan of several years, rather than a dozen years. However, the bonded metal solution performs a lot, lot better – metal conducts heat better than the silicon-based pastes – but it is slightly more expensive (a dollar or two per unit, at most, when the materials and manufacturing are taken into account).
Thermal Interface | |||||||
Intel | Celeron | Pentium | Core i3 | Core i5 | Core i7 Core i9 |
HEDT | |
Sandy Bridge | LGA1155 | Paste | Paste | Paste | Bonded | Bonded | Bonded |
Ivy Bridge | LGA1155 | Paste | Paste | Paste | Paste | Paste | Bonded |
Haswell / DK | LGA1150 | Paste | Paste | Paste | Paste | Paste | Bonded |
Broadwell | LGA1150 | Paste | Paste | Paste | Paste | Paste | Bonded |
Skylake | LGA1151 | Paste | Paste | Paste | Paste | Paste | Paste |
Kaby Lake | LGA1151 | Paste | Paste | Paste | Paste | Paste | - |
Coffee Lake | 1151 v2 | Paste | Paste | Paste | Paste | Paste | - |
CFL-R | 1151 v2 | ? | ? | ? | K = Bonded | - | |
AMD | |||||||
Zambezi | AM3+ | Bonded | Carrizo | AM4 | Bonded | ||
Vishera | AM3+ | Bonded | Bristol R | AM4 | Bonded | ||
Llano | FM1 | Paste | Summit R | AM4 | Bonded | ||
Trinity | FM2 | Paste | Raven R | AM4 | Paste | ||
Richland | FM2 | Paste | Pinnacle | AM4 | Bonded | ||
Kaveri | FM2+ | Paste / Bonded* | TR | TR4 | Bonded | ||
Carrizo | FM2+ | Paste | TR2 | TR4 | Bonded | ||
Kabini | AM1 | Paste | |||||
*Some Kaveri Refresh were bonded |
In our Ryzen APU delidding article, we went through the process of removing the heatspreader and conductive paste from a popular low cost product, and we showed that replacing that paste with a bonded liquid metal improved temperatures, overclocking, and performance in mid-range overclocks. If any company wants to make enthusiasts happy, using a bonded metal is the way to go.
For several years, Intel has always stated that they are there for enthusiasts. In the distant past, as the table above shows, Intel provided processors with a soldered bonded metal interface and was happy to do so. In recent times however, the whole product line was pushed into the heat conductive paste for a number of reasons.
As Intel was continually saying that they still cared about enthusiasts, a number of users were concerned that Intel was getting itself confused. Some believed that Intel had ‘enthusiasts’ and ‘overclockers’ in two distinct non-overlapping categories. It is what it is, but now Intel has returned to using applying STIM and wants to court overclockers again.
Intel has officially confirmed that new 9th generation processors will feature a layer of solder making up the TIM between the die and the IHS. The new processors with solder include the Core i9-9900K, the Core i7-9700K and Core i5-9600K.
As we’ll show in this review, the combination of STIM plus other features are of great assistance when pushing the new processors to the overclocking limits. Intel’s own overclocking team at the launch event hit 6.9 GHz temporarily using exotic sub-zero coolants such as liquid nitrogen.
Motherboards and the Z390 Chipset
One of the worst kept secrets this year has been Intel’s Z390 chipset. If you believe everything the motherboard manufacturers have told me, most of them had been ready for this release for several months, hence why seeing around 55 new motherboards hit the market this month and into next.
The Z390 chipset is an update to Z370, and both types of motherboards will support 8000-series and 9000-series processors (Z370 will need a BIOS update). The updates are similar to the updates seen with B360: native USB 3.1 10 Gbps ports, and integrated Wi-Fi on the chipset.
Intel Z390, Z370 and Z270 Chipset Comparison | |||
Feature | Z390 | Z370 | Z270 |
Max PCH PCIe 3.0 Lanes | 24 | 24 | 24 |
Max USB 3.1 (Gen2/Gen1) | 6/10 | 0/10 | 0/10 |
Total USB | 14 | 14 | 14 |
Max SATA Ports | 6 | 6 | 6 |
PCIe Config | x16 x8/x8 x8/x4/x4 |
x16 x8/x8 x8/x4/x4 |
x16 x8/x8 x8/x4/x4 |
Memory Channels | 2 | 2 | 2 |
Intel Optane Memory Support | Y | Y | Y |
Intel Rapid Storage Technology (RST) | Y | Y | Y |
Max Rapid Storage Technology Ports | 3 | 3 | 3 |
Integrated 802.11ac WiFi MAC | Y | N | N |
Intel Smart Sound | Y | Y | Y |
Integrated SDXC (SDA 3.0) Support | Y | N | N |
DMI | 3.0 | 3.0 | 3.0 |
Overclocking Support | Y | Y | Y |
Intel vPro | N | N | N |
Max HSIO Lanes | 30 | 30 | 30 |
Intel Smart Sound | Y | Y | Y |
ME Firmware | 12 | 11 | 11 |
The integrated Wi-Fi uses CNVi, which allows the motherboard manufacturer to use one of Intel’s three companion RF modules as a PHY, rather than using a potentially more expensive MAC+PHY combo from a different vendor (such as Broadcom). I have been told that the cost of implementing a CRF adds about $15 to the retail price of the board, so we are likely to see some vendors experiment with mid-price models with-and-without Wi-Fi using this method.
ASRock Z390 Phantom Gaming-ITX/ac
For the USB 3.1 Gen 2 ports, Type-A ports are supported natively and motherboard manufacturers will have to use re-driver chips to support Type-C reversibility. These come at extra cost, as one might expect. It will be interesting to see how manufacturers mix and match the Gen 2, Gen 1, and USB 2.0 ports on the rear panels, now they have a choice. I suspect it will come down to signal integrity on the traces on the motherboard.
For the Z390 chipset and motherboards, we have our usual every-board-overview post, covering every model the manufacturers would tell us about. Interestingly there is going to be a mini-ITX with Thunderbolt 3, and one board with a PLX chip! There are also some motherboards with Realtek’s 2.5G Ethernet controller – now if only we also had consumer grade switches.
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vext - Friday, October 19, 2018 - link
Very good article, but here are my beefs.Why is there no mention of temperatures?
According to Techspot the 9900k runs ridiculously hot under heavy loads. At stock clocks under a heavy Blender load it reaches 85C with a Corsair H100i Pro, or Noctua NH-D15. Pushed to 5Ghz, it hits 100C. At 5.1 Ghz it FAILS. I suggest that Anandtech has failed by not discussing this.
Techspot says:
"There’s simply no way you’re going to avoid thermal throttling without spending around $100 on the cooler, at least without your PC sounding like a jet about to take off. Throw in the Corsair H100i Pro and the 9900K now costs $700 and you still can’t overclock, at least not without running at dangerously high temperatures."
Why the focus on single threaded benchmarks? For the most part they are irrelevant. Yet they are posted in their own graph, at the front of each testing section, as though they were the most important data point. Just include them as a separate bar with the multi-thread benchmarks. Good Grief!
Why post MSRP prices in every single benchmark? You can't even buy them for MSRP. There should be a single chart at the front of the article with a rough retail estimate for each processor, and links to the retailers. If the MSRP is necessary, then just add a column to the chart. Sheesh.
Why no in depth cost/benefit comparison? A Ryzen 2600 with included cooler at $160 costs only one quarter of a 9900k with an aio cooler at $700. The $540 difference would buy a new RTX 2070 video card. Or three more Ryzen 2600's. For crying out loud.
I like the 9900k, it's a good processor. It's intended for hobbyists that can play with custom loop cooling. But it's not realistic for most people.
mapesdhs - Sunday, October 21, 2018 - link
All good questions... the silence is deafening. Thankfully, there's plenty of commentary on the value equation to be found. A small channel atm, but I like this guy's vids:https://www.youtube.com/watch?v=EWO5A9VMcyY
abufrejoval - Friday, October 19, 2018 - link
I needed something a little bigger for my lab two or three years ago and came across an E5-2696v3 on eBay from China, a Haswell generation 18-core at $700.That chips didn't officially exist, but after digging a little deeper I found it's basically an E5-2699v3 which clocks a little higher (3.8 instead of 3.6GHz) with 1-2 cores active. So it's basically a better chip for a fraction of the going price of the lesser one (E5-2699v3 is still listed at €4649 by my favorite e-tailer). And yes, it's a perfect chip, Prime95'd it for hours, POVrayd and Blendered for days until I was absolutely sure it was a prime quality chip.
Officially it has 145Watts TDP, but I've only ever seen it go to 110Watts on HWiNFO with Prime95 in its meanest settings: It must be a perfect bin. With the particle pusher it's never more than 93Watts while no part of the CPU exceeds 54°C with a Noctua 140mm fan practically inaudible at 1000rpm cooling it: That because the 18 cores and 36 threads never run faster than 2.8GHz fully loaded. They also don't drop below it (except for idle, 1.855 Watts minimum btw.), so you can pretty much forget about the 2.3GHz 'nominal' speed.
It gets 2968.245803 on that benchmark, slightly above the i9-9900k, somewhat below the ThreadRipper. That's 22nm Haswell against 14++/12nm current and 18 vs 8/12 cores.
This is rather typical for highly-threaded workloads: It's either cores or clocks and when the power ceiling is fixed you get higher throughput and energy efficiency when you can throw cores instead of clocks at the problem.
I think it's a data point worth highlighting in this crazy clock race somewhat reminiscent of Pentium 4 days, heat vs. efficiency, a four year old chip beating the newcomer in performance and almost 3:1 in efficiency at far too similar prices.
Yet, this specific chip will clock pretty high for a server chip, easily doing 3.6 GHz with eight cores seeing action from your game engine, while the remaining ten are often ignored: Perhaps that's a Ryzen effect, it used to be 4:14 earlier.
I've done BCLK overclock of 1.08 to have it reach the magic 4GHz at maximum turbo, but it's not noticeable in real-life neck-to-neck to an E3-1276v3 which also turbos to 4GHz on three cores out of four available, 3.9 at 4/4 with HT.
abufrejoval - Friday, October 19, 2018 - link
2968.245803 on the particle pusher benchmark... need editicoreaudience - Friday, October 19, 2018 - link
Move away from rar/lzma : the new darling of data compression is called Zstandard :https://www.zstd.net
It comes with a nice integrated benchmark, which can easily ramp up with multithreading :
zstd -b -1 -T8 fileToTest # benchmark level one on fileToTest using 8 threads
Windows user can even download a pre-compiled binary directly in the release notice :
https://github.com/facebook/zstd/releases/latest
It would be great to see some numbers using this compressor on latest Intel cores !
Kaihekoa - Friday, October 19, 2018 - link
Looks like all your gaming benchmarks are GPU bound and there pointless. Why not use a 2080 Ti to eliminate/reduce GPU bottleneck?Kaihekoa - Friday, October 19, 2018 - link
therefore*palladium - Friday, October 19, 2018 - link
Can you please run some SPEC2006 benchmarks and see if Apple's SOC really has caught on to Intel's performance (per core), as mentioned in Andrei in his iPhone XS review? ThanksVirpZ - Friday, October 19, 2018 - link
Apart from blender, your review is full Intel biased software for rendering.Hifihedgehog - Friday, October 19, 2018 - link
Hey Ian. I see your updated full load power consumptions results. Question: Why is it that the six-core i7-8086K is drawing so little power in comparison to everything else including the quad-cores? Is this due to its better binning or is this simply an error that crept in?