Memory

It would seem that Micron this morning has accidentally spilled the beans on the future of graphics card memory technologies – and outed one of NVIDIA’s next-generation RTX video cards in the process. In a technical brief that was posted to their website, dubbed “The Demand for Ultra-Bandwidth Solutions”, Micron detailed their portfolio of high-bandwidth memory technologies and the market needs for them. Included in this brief was information on the previously-unannounced GDDR6X memory technology, as well as some information on what seems to be the first card to use it, NVIDIA’s GeForce RTX 3090. The key innovation for GDDR6X appears to be that Micron is moving from using POD135 coding on the memory bus – a binary (two state) coding format – to four...

ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP

ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...

15 by Anton Shilov on 12/2/2019

Spotted at Supercomputing 2019: A 256 GB Gen-Z Memory Module

As a millennial, everything in the media that ‘Gen Z’ does often gets lumped into the millennial category. Thankfully there’s another type of Gen-Z in the world: the cache...

11 by Dr. Ian Cutress on 11/29/2019

GlobalFoundries and SiFive to Design HBM2E Implementation on 12LP/12LP+

GlobalFoundries and SiFive announced on Tuesday that they will be co-developing an implementation of HBM2E memory for GloFo's 12LP and 12LP+ FinFET process technologies. The IP package will enable...

13 by Anton Shilov on 11/5/2019

GIGABYTE Enhances Aorus RGB Memory with Aorus Memory Boost Capability

One of the advantages of having a highly-integrated product stack is ability to fine tune performance of your devices when they work together. On the one hand, this allows...

6 by Anton Shilov on 11/1/2019

GlobalFoundries Teams Up with Singapore University for ReRAM Project

GlobalFoundries has announced that the company has teamed up with Singapore’s Nanyang Technological University and the National Research Foundation to develop resistive random access memory (ReRAM). The next-generation memory...

14 by Anton Shilov on 10/28/2019

Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage

Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12...

30 by Anton Shilov on 10/24/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

6 by Anton Shilov on 10/22/2019

Team Group Quietly Launches 32 GB DDR4 Memory Modules

Team Group has quietly added 32 GB unbuffered DDR4 memory modules to its product catalogue and plans to start sales in the near future. The modules will feature JEDEC-standard...

8 by Anton Shilov on 10/22/2019

Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel

Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...

14 by Anton Shilov on 10/21/2019

Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI

The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...

38 by Anton Shilov on 10/11/2019

G.Skill Launches 32 GB DDR4 Modules, 256 GB Kits: Up to DDR4-4000

G.Skill has now rolled out its 32 GB unbuffered DDR4 modules in dual-channel and quad-channel memory kits. The modules are offered with data transfer rates from 2666 MT/s to...

27 by Anton Shilov on 10/9/2019

Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2

Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...

11 by Anton Shilov on 10/7/2019

Gen-Z PHY Specification 1.1 Published: Adds PCIe 5.0, Gen-Z 50G Fabric

The Gen-Z Consortium this week released Physical Layer Specification 1.1 for Gen-Z interconnects. The new standard adds enhanced support for PCIe Gen 5 as well as Gen-Z 50G Fabric...

8 by Anton Shilov on 10/4/2019

Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon

Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...

10 by Anton Shilov on 10/4/2019

Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit

Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...

12 by Anton Shilov on 9/13/2019

YMTC Starts Volume Production of 64-Layer 3D NAND

Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...

3 by Anton Shilov on 9/5/2019

Hot Chips 31 Analysis: In-Memory Processing by UPMEM

One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...

37 by Dr. Ian Cutress on 8/19/2019

Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019

Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...

21 by Anton Shilov on 8/16/2019

Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology

Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...

25 by Anton Shilov on 8/16/2019

SMART Modular Shows Off 256 GB Gen-Z Memory Module

SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...

16 by Anton Shilov on 8/15/2019

Log in

Don't have an account? Sign up now