Semiconductors

One of the core challenges that Rapidus will face when it kicks off volume production of chips on its 2nm-class process technology in 2027 is lining up customers. With Intel, Samsung, and TSMC all slated to offer their own 2nm-class nodes by that time, Rapidus will need some kind of advantage to attract customers away from its more established rivals. To that end, the company thinks they've found their edge: fully automated packaging that will allow for shorter chip lead times than manned packaging operations. In an interview with Nikkei, Rapidus' president, Atsuyoshi Koike, outlined the company's vision to use advanced packaging as a competitive edge for the new fab. The Hokkaido facility, which is currently under construction and is expecting to begin equipment installation...

LG Display & SK Hynix Looking to Diversify Industrial Suppliers as Row with Japan Intensifies

South Korean electronics companies reaffirmed this week that production of computer memory and displays could be disrupted because of ongoing trade dispute between the country and Japan. Both SK...

8 by Anton Shilov on 7/26/2019

TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged

Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is...

76 by Anton Shilov on 7/23/2019

Samsung’s 5nm EUV Technology Gets Closer: Tools by Cadence & Synopsys Certified

Samsung Foundry has certified full flow tools from Cadence and Synopsys for its 5LPE (5 nm low-power early) process technology that uses extreme ultraviolet lithography (EUV). Full flow design...

13 by Anton Shilov on 7/8/2019

Synopsys to Accelerate Samsung’s 7nm Ramp with Yield Explorer Platform

Synopsys has announced an acceleration of development on its yield learning platform designed to speed up ramp up of chips made using Samsung Foundry’s 7LPP (7 nm low power...

16 by Anton Shilov on 7/4/2019

Marvell to Acquire Avera Semiconductor from GlobalFoundries

Marvell on Monday announced that it had entered into agreement to buy Avera Semiconductor from GlobalFoundries. The acquisition will bring additional chip design capabilities to Marvell and will enable...

8 by Anton Shilov on 5/20/2019

Samsung Announces 3nm GAA MBCFET PDK, Version 0.1

So what comes after 7nm, after 6nm, after 5nm, and after 4nm? That's right: 3nm! At Samsung's Foundry Forum event today, Samsung has announced that the first alpha version...

32 by Dr. Ian Cutress on 5/14/2019

Intel Process Technology Update: 10nm Server Products in 1H 2020, Accelerated 7nm in 2021

Intel provided an update regarding its upcoming fabrication technologies at its 2019 Investor Meeting. The company is on track to produce server-class products using its 10 nm manufacturing technology...

74 by Anton Shilov on 5/8/2019

TSMC: Most 7nm Clients Will Transition to 6nm

In this week's quarterly earnings conference call, TSMC’s revealed that the company expects most of its 7nm "N7" process customers to eventually transition to its forthcoming 6nm "N6" manufacturing...

39 by Anton Shilov on 5/1/2019

Samsung to Invest $115 Billion in Foundry & Chip Businesses by 2030

Being among the largest contract makers of semiconductors and among leading developers of chips for various applications, Samsung Electronics wants to become the world’s leader in these industries. To...

27 by Anton Shilov on 4/24/2019

GlobalFoundries to Sell 300mm New York Fab to ON Semiconductor

GlobalFoundries and ON Semiconductor on Monday signed a definitive agreement for the latter to buy GlobalFoundries’ 300-mm fab in East Fishkill, New York. In addition to the production facility...

25 by Anton Shilov on 4/22/2019

TSMC: No Plans to Buy Rivals at The Moment

Although TSMC expects demand for chips to increase going forward and despite an ongoing trend towards consolidation on the foundry market, the company has commented that it currently has...

4 by Anton Shilov on 4/22/2019

Samsung Completes Development of 5nm EUV Process Technology

Samsung Foundry this week announced that it has completed development of its first-generation 5 nm fabrication process (previously dubbed 5LPE). The manufacturing technology uses extreme ultraviolet lithography (EUVL) and...

21 by Anton Shilov on 4/17/2019

TSMC Reveals 6 nm Process Technology: 7 nm with Higher Transistor Density

TSMC this week unveiled its new 6 nm (CLN6FF, N6) manufacturing technology, which is set to deliver a considerably higher transistor density when compared to the company's 7 nm...

23 by Anton Shilov on 4/17/2019

TSMC’s 5nm EUV Making Progress: PDK, DRM, EDA Tools, 3rd Party IP Ready

TSMC this week has said that it has completed development of tools required for design of SoCs that are made using its 5 nm (CLN5FF, N5) fabrication technology. The...

33 by Anton Shilov on 4/5/2019

GlobalFoundries and Synopsys Develop Automotive-Grade IP for 22FDX Process Tech

GloalFoundries and Synopsys announced this week that they have jointly developed a portfolio of automotive-gade IP solutions for GF’s 22FDX process technology. The various IP blocks are designed for...

4 by Anton Shilov on 2/22/2019

TSMC’s Fab 14B Photoresist Material Incident: $550 Million in Lost Revenue

TSMC on Friday revealed more details regarding an incident with a photoresist material at its Fab 14B earlier this year. The contaminated chemical damaged wafers on TSMC’s 12 nm...

29 by Anton Shilov on 2/20/2019

Intel Submits Ireland Fab Expansion Plan: $8 Billion Price Tag, With a 4 Year Lead Time

Intel has submitted a proposal to Irish authorities for the expansion of its manufacturing site near Leixlip. According to the plans, Intel is exploring the construction of a brand-new...

27 by Anton Shilov on 2/13/2019

SMIC To Start 14nm Mass Production in H1 2019

Reports have emerged this week that SMIC, the largest foundry in China, is set to start mass production using its in-house developed 14 nm FinFET manufacturing technology in the...

20 by Anton Shilov on 2/8/2019

Intel Details Plans for Its Oregon Fab Expansion: D1X Phase 3

Intel this week revealed the first details concerning its fab expansion plans in Oregon. As it turns out, the company intends to build the third phase of its D1X...

26 by Anton Shilov on 2/5/2019

GlobalFoundries to Sell 200-mm Fab 3E to Vanguard, Exits MEMS Business

GlobalFoundries announced on Thursday that it had agreed to sell its Fab 3E in Singapore to Vanguard International Semiconductor (VIS) as part of a broader plan to exit the...

34 by Anton Shilov on 2/1/2019

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