DRAM
At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory promises high performance for memory overclockers and gamers. Looking to rival the high-speed DDR5 kits from companies such as G.Skill, the T-Force Xtreem DDR5 memory is available up to DDR5-8266, with overclocked XMP 3.0 profiles designed to be used with Intel's 13th Gen Core series processors. Regarding the competition, the T-Force Xtreme DDR5-8266 will be one of, if not the fastest, fastest kit available at retail upon its launch, as G.Skill has a kit of their Trident Z5 DDR5-8000 at retail. The most glamorous looking of the two kits is the T-Force Xtreem ARGB DDR5 memory, with...
Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex
Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now...
3 by Anton Shilov on 6/2/2023
Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000
Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer...
5 by Anton Shilov on 5/30/2023
SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...
5 by Anton Shilov on 5/30/2023
Micron Expects Impact as China Bans Its Products from 'Critical' Industries
In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...
12 by Anton Shilov on 5/23/2023
Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025
Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...
10 by Anton Shilov on 5/19/2023
Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works
Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power...
16 by Anton Shilov on 5/18/2023
As The Demand for HBM Explodes, SK Hynix is Expected to Benefit
The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...
9 by Anton Shilov on 4/18/2023
Samsung Becomes Latest Memory Fab to Cut Production Amidst Post-Pandemic Slump
Following an ongoing slump in demand that has impacted the entire memory industry over the last several months, Samsung this week has become the latest memory foundry to announce...
11 by Anton Shilov on 4/7/2023
Kingston Launches Fury Beast And Fury Renegade DDR5 Memory in White
Kingston Fury, the gaming and high-performance division of Kingston Technology Company, Inc., has expanded the aesthetics of the company's Fury DDR5 memory portfolio. The Fury Beast and Fury Renegade...
17 by Zhiye Liu on 3/28/2023
SK hynix Intros LPDDR5T Memory: Low Power RAM at up to 9.6Gbps
In a bit of a surprise move, SK hynix this week has announced a new variation of LPDDR5 memory technology, which they are calling LPDDR5T. Low Power Double Data...
10 by Ryan Smith on 1/25/2023
Micron Announces 20-Year Plan To Build $100 Billion U.S. Fab Complex
Now that the U.S. government has finally settled the matter of whether it would be providing subsidies to entice chip fabs to setup shop within the U.S., those fabs...
48 by Anton Shilov on 10/10/2022
Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.
Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...
23 by Anton Shilov on 9/14/2022
Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...
26 by Anton Shilov on 8/19/2022
Crucial Ballistix Memory Goes End-of-Life, Micron Realigns its DRAM Strategy
Underscoring the fast-paced nature of the computer hardware market, Micron this week has decided to discontinue all of its current Crucial Ballistix memory products. The move to end-of-life (EOL...
13 by Gavin Bonshor on 2/17/2022
ASUS Demonstrates DDR5 to DDR4 Converter Card
One of the key issues with purchasing a modern Alder Lake system today is the cost of the memory, especially when an enthusiast wants to use DDR5. Due to...
31 by Dr. Ian Cutress on 12/30/2021
SK Hynix to Manufacture 48 GiB and 96 GiB DDR5 Modules
Today SK Hynix is announcing the sampling of its next generation DDR5 memory. The headline is the commercialization of a new 24 gigabit die, offering 50% more capacity than...
22 by Dr. Ian Cutress on 12/14/2021
Samsung Announces First LPDDR5X at 8.5Gbps
After the publication of the LPDDR5X memory standard earlier this summer, Samsung has now been the first vendor to announce new modules based on the new technology. The LPDDR5X standard...
19 by Andrei Frumusanu on 11/9/2021
SK Hynix Announces Its First HBM3 Memory: 24GB Stacks, Clocked at up to 6.4Gbps
Though the formal specification has yet to be ratified by JEDEC, the memory industry as a whole is already gearing up for the upcoming launch of the next generation...
19 by Ryan Smith on 10/20/2021
Samsung Teases 512 GB DDR5-7200 Modules
This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point...
27 by Dr. Ian Cutress on 8/22/2021
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