DRAM
Samsung early on Friday revealed the world's first 32 Gb DDR5 DRAM die. The new memory die is made on the company's 12 nm-class DRAM fabrication process and not only offers increased density, but also lowers power consumption. The chip will allow Samsung to build record 1 TB RDIMMs for servers as well as lower costs of high-capacity memory modules. “With our 12nm-class 32 Gb DRAM, we have secured a solution that will enable DRAM modules of up to 1 TB, allowing us to be ideally positioned to serve the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data,” said SangJoon Hwang, executive vice president of DRAM product & technology at Samsung Electronics. 32 Gb memory dies not only...
ASUS Z390 Platforms Now Support 128 GB of Memory
ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...
8 by Anton Shilov on 1/22/2019
CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs
GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...
3 by Anton Shilov on 1/14/2019
CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD
One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...
5 by Gavin Bonshor on 1/10/2019
CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory
At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...
13 by Gavin Bonshor on 1/9/2019
Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86
It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...
149 by Dr. Ian Cutress on 12/12/2018
Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems
Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...
5 by Anton Shilov on 11/26/2018
Your Highness: G.Skill Trident Z Royal, Bling Factor 11
G.Skill this week has officially introduced its Trident Z Royal family of memory modules. This memory featuring crystalline light bars with RGB lighting and polished heat spreaders. The modules...
4 by Anton Shilov on 11/20/2018
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK
One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...
19 by Ian Cutress on 11/9/2018
Micron Kicks Off Mass Production of 12 Gb LPDDR4X DRAM Chips
Micron this week announced that it had started mass production of its first LPDDR4X memory devices using its second-generation 10 nm-class process technology. The new memory devices offer standard...
10 by Anton Shilov on 11/8/2018
U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage; Bans Exports To Firm
The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian...
58 by Anton Shilov on 11/1/2018
Samsung Shows Off 256 GB DDR4 RDIMM: Coming to Servers Soon
Samsung this week demonstrated its first 256 GB memory module for upcoming servers. The new Registered DIMM (RDIMM) is based on Samsung’s 16 Gb DDR4 memory devices introduced earlier...
18 by Anton Shilov on 10/19/2018
Cadence & Micron DDR5 Update: 16 Gb Chips on Track for 2019
Earlier this year Cadence and Micron performed the industry’s first public demonstration of next-generation DDR5 memory. At a TSMC event earlier this month the two companies provided some updates...
18 by Anton Shilov on 10/17/2018
Intel to Support 128GB of DDR4 on Core 9th Gen Desktop Processors
One of today’s announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up...
24 by Ian Cutress on 10/15/2018
Colorful Enters DRAM Module Business: Generic Colorfire & Custom iGame DIMMs
Colorful has introduced its first memory modules, officially adding a new product category that will complement its graphics cards, motherboards, and SSDs. The initial lineup consists of generic DIMMs...
4 by Anton Shilov on 10/1/2018
Double Height, Double Capacity DDR4? ZADAK's New 32 GB UDIMMs
ZADAK, a maker of memory modules from Taiwan, has reportedly published photos of its upcoming unbuffered memory modules featuring a 32 GB capacity. The UDIMMs and SO-DIMMs are the...
22 by Anton Shilov on 9/28/2018
Micron to Expand Its Fab 6 in Virginia, Build New R&D Center
Micron this week announced plans to expand production of DRAM and NAND memory at its fab in Manassas, Virginia. In total, Micron intends to invest $3 billion into the...
11 by Anton Shilov on 8/31/2018
Hot Chips 2018: Nanotubes as DRAM from Nantero, a Live Blog
Lots of different types of 'RAM' have been in the news, most noticably Intel's Optane memory and a couple of weeks ago at Flash Memory Summit we had the...
19 by Ian Cutress on 8/21/2018
SK Hynix Set to Build a New Memory Fab
SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...
16 by Anton Shilov on 7/30/2018
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