Over the last couple of years, a great deal of concern has developed around the future of semiconductor manufacturing, both with respect to total capacity and where the next generation of fabs will be hosted. The current chip crunch has underscored that current fab capacity is too small for a world where there’s a silicon chip in practically everything, and meanwhile geopolitical matters have made nations increasingly worried about where today’s cutting-edge fabs are located – mostly in Taiwan and South Korea. Consequently, we’ve seen governments kick-start initiatives to woo fab companies or otherwise incentivize the domestic construction of next-generation fabs, including the United States Department of Defense, whom today is awarding Intel an agreement to provide commercial foundry services for the DoD. As announced...

Intel’s First High-Profile IFS Fab Customer: Qualcomm Jumps on Board For 20A Process

Alongside Intel’s sizable announcement today regarding their manufacturing roadmap over the next half-decade, the company is also announcing their first major customer for their third-party foundry service, IFS. And...

59 by Ryan Smith on 7/26/2021

Intel's Process Roadmap to 2025: with 4nm, 3nm, 20A and 18A?!

In today’s Intel Accelerated event, the company is driving a stake into the ground regarding where it wants to be by 2025. CEO Pat Gelsinger earlier this year stated...

325 by Dr. Ian Cutress on 7/26/2021

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