AI

MLCommons, the consortium behind the MLPerf family of machine learning benchmarks, is announcing this morning that the organization will be developing a new desktop AI benchmarking suite under the MLPerf banner. Helmed by the body’s newly-formed MLPerf Client working group, the task force will be developing a client AI benchmark suit aimed at traditional desktop PCs, workstations, and laptops. According to the consortium, the first iteration of the MLPerf Client benchmark suite will be based on Meta’s Llama 2 LLM, with an initial focus on assembling a benchmark suite for Windows. The de facto industry standard benchmark for AI inference and training on servers and HPC systems, MLCommons has slowly been extending the MLPerf family of benchmarks to additional devices over the past several years...

The Intel CES 2024 Pat Gelsinger Keynote Live Blog (Starts at 5pm PT/01:00 UTC)

This evening is the biggest PC-related keynote of CES 2024, Intel's "prime" keynote with CEO Pat Gelsinger. Part of Intel's "AI everywhere starts with Intel" campaign for the show...

0 by Ryan Smith & Gavin Bonshor on 1/9/2024

Intel Unveils First SDV SoC Family For The Automotive Market at CES 2024

Further to Intel's AI-related announcements surrounding their Meteor Lake SoC and its integrated NPU, the automotive market is another market where Intel expects that AI can make a big...

10 by Gavin Bonshor on 1/9/2024

Microsoft Swaps Menu Key For Copilot AI Key on Windows Keyboards, Directs OEMs To Do The Same

Microsoft is betting big on artificial intelligence and generative AI at all levels of the company, from servers and Azure down to individual Windows PCs. And that big bet...

30 by Anton Shilov on 1/4/2024

AMD Unveils XA Versal AI Edge and Ryzen Embedded V2000A For Automotive

With CES 2024 fast approaching, AMD has announced two new products designed to enhance user's experience in the automotive sphere. The first is the XA Versal AI Edge series...

13 by Gavin Bonshor on 1/4/2024

ASRock Industrial 4X4 BOX 8040 and NUC(S) Ultra 100 BOX Series Bring Accelerated AI to Mini-PCs

ASRock Industrial maintains a lineup of ultra-compact form-factor machines in the NUC BOX (Intel-based) and 4X4 BOX (AMD-based) series. These systems have gained significant market acceptance (evidenced by the...

10 by Ganesh T S on 12/23/2023

Intel Releases Core Ultra H and U-Series Processors: Meteor Lake Brings AI and Arc to Ultra Thin Notebooks

Intel has released their first mobile processors based on their highly anticipated Meteor Lake platform, the Core Ultra H and the Core Ultra U series. Available today, the Ultra...

89 by Gavin Bonshor on 12/14/2023

AMD Unveils Ryzen 8040 Mobile Series APUs: Hawk Point with Zen 4 and Ryzen AI

Although CES 2024 is happening next month in Las Vegas, AMD has lifted the lid on their latest Zen 4 mobile processors, the Ryzen Mobile 8040 series. Codenamed Hawk...

24 by Gavin Bonshor on 12/6/2023

AMD Widens Availability of Ryzen AI Software For Developers, XDNA 2 Coming With Strix Point in 2024

Further to the announcement that AMD is refreshing their Phoenix-based 7040HS series for mobiles with the newer 'Hawk Point' 8040HS family for 2024, AMD is set to drive more...

21 by Gavin Bonshor on 12/6/2023

The AMD Advancing AI & Instinct MI300 Launch Live Blog (Starts at 10am PT/18:00 UTC)

This morning is an important one for AMD – perhaps the most important of the year. After almost a year and a half of build-up, and even longer for...

10 by Ryan Smith & Gavin Bonshor on 12/6/2023

Amazon's Trainium2 AI Accelerator Features 96 GB of HBM, Quadruples Training Performance

Amazon Web Services this week introduced Trainium2, its new accelerator for artificial intelligence (AI) workload that tangibly increases performance compared to its predecessor, enabling AWS to train foundation models...

19 by Anton Shilov on 11/30/2023

Arm Total Design to Facilitate Development of Custom Datacenter SoCs

Arm this week introduced its Arm Total Design initiative, which is aimed at accelerating development of custom datacenter-oriented system-on-chip (SoC) designs using Neoverse Compute Subsystems (CSS). The collaborative ecosystem...

1 by Anton Shilov on 10/18/2023

Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet

Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power codenamed Quasar chiplet for machine learning workloads. The...

13 by Anton Shilov on 10/3/2023

Synopsys Surpasses $500M/Year in AI Chip Revenue, Expects Further Rapid Growth

Demand for generative artificial intelligence (AI) applications is so high that NVIDIA's high-performance compute GPUs like A100 and H100 are reportedly sold out for quarters to come. Dozens of...

5 by Anton Shilov on 8/22/2023

AI Server Market to Reach $150 Billion by 2027 - Foxconn

Demand for generative AI services is skyrocketing and driving the need for AI servers and machines that are substantially different from traditional servers. The category is growing so quickly...

4 by Anton Shilov on 8/16/2023

Cloud Provider Gets $2.3 Billion Debt Using NVIDIA's H100 as Collateral

CoreWeave, an NVIDIA-backed cloud service provider specializing in GPU-accelerated services, has secured a debt facility worth $2.3 billion using NVIDIA's H100-based hardware as collateral. The company intends to use...

18 by Anton Shilov on 8/4/2023

Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI

Cerebras Systems and G42, a tech holding group, have unveiled their Condor Galaxy project, a network of nine interlinked supercomputers for AI model training with aggregated performance of 36...

1 by Anton Shilov on 7/21/2023

The Aurora Supercomputer Is Installed: 2 ExaFLOPS, Tens of Thousands of CPUs and GPUs

Argonne National Laboratory and Intel said on Thursday that they had installed all 10,624 blades for the Aurora supercomputer, a machine announced back in 2015 with a particularly bumpy...

39 by Anton Shilov on 6/22/2023

AMD Ryzen Pro 7000 and 7040 Series Processors : Zen 4 For Commercial Deployments

As is a constant whenever AMD launches their latest desktop and mobile processors, they typically deploy and release a professional and commercial line-up of these processors a few months...

8 by Gavin Bonshor on 6/13/2023

TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors

As part of their efforts to push the boundaries on the largest manufacturable chip sizes, Taiwan Semiconductor Manufacturing Co. is working on its new Chip-On-Wafer-On-Substrate-L (CoWoS-L) packaging technology that...

2 by Anton Shilov on 5/26/2023

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